| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E3-1200 v3 |
| Model number ? | E3-1230L v3 |
| CPU part number |
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| Frequency ? | 1800 MHz |
| Turbo frequency | 2800 MHz (1 core) 2300 MHz (2 cores) |
| Bus speed ? | 5 GT/s DMI |
| Package | 1150-land Flip-Chip Land Grid Array |
| Socket | Socket 1150 / H3 / LGA1150 |
| Size | 1.48" x 1.48" / 3.75cm x 3.75cm |
| Introduction date | June 2, 2013 (launch) June 4, 2013 (announcement) |
| Price at introduction | $250 |
| S-spec numbers | |
| Architecture / Microarchitecture | |
| Microarchitecture | Haswell |
| Platform | Denlow |
| Processor core ? | Haswell LGA1150 |
| Core stepping ? | C0 (QEEL, QEJ7, SR158) |
| Manufacturing process | 0.022 micron |
| Data width | 64 bit |
| The number of CPU cores | 4 |
| The number of threads | 8 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 4 x 32 KB instruction caches 4 x 32 KB data caches |
| Level 2 cache size ? | 4 x 256 KB |
| Level 3 cache size | 8 MB |
| Physical memory | 32 GB |
| Multiprocessing | Uniprocessor |
| Features |
|
| Low power features |
|
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1333, DDR3-1600 DIMMs per channel: up to 2 Maximum memory bandwidth (GB/s): 25.6 ECC supported: Yes |
| Other peripherals |
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| Electrical / Thermal parameters | |
| Thermal Design Power ? | 25 Watt |
