Key Features

1. Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
2. Intel® C622
3. Up to 1.5TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots
4. 1 PCI-E 3.0 x32 Left Riser Slot,
   1 PCI-E 3.0 x16 Right Riser Slot,
   1 PCI-E 3.0 x16 for Add-On-Module (AOM)
   M.2 Interface: PCIe 3.0 x4
   M.2 Form Factor: 2260, 2280, 22110
   M.2 Key: M-Key
   U.2 Interface: PCIe 3.0 x4,
   4 PCI-E 3.0 NVMExpress x4 Internal Port(s)
5. 1 VGA port(s)
6. Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
7. Dual LAN with 10Gbase-T
   from C622